Glass Stiffener
Flex PCB with Flip Chip and Glass Stiffener |
|
Layers |
2 |
Substrate Thickness | 2 mils |
Copper Weight |
1 1/4 oz |
Min Line / Space | 2/2 |
Final Finish | ENEPIG |
Additional Details | Flip Chip Array for Wire Bonding; Optical Glass Stiffener; Polyimide Stiffener for Connector |