Glass Stiffener

Flex PCB with Flip Chip and Glass Stiffener
Layers                               
2                                                   
Substrate Thickness 2 mils
Cu Weight              
1 1/4 oz
Minimum Line / Space 2/2
Finish ENEPIG
Industry  
Additional Details Flip Chip Array for Wire Bonding; Optical Glass Stiffener; Polyimide Stiffener for Connector

 

 

 

 

 

 

 
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