HDI Copper Via Fill


Bare Board Specifications
 Layer Count  4                                                  
 Copper Weight  1 oz
 Min Line / Space              4 / 4 mil
 Final Finish  ENIG + Soft, Wire-Bondable Gold
 Blind Vias  1+2+1: L1-L2 + L3-L4 Cu-filled Blind Vias
 Buried Vias  Layer 2 - L3 Buried Vias
 Additional  Laser-Trimmed Black Coverlay; Copper Via Fill
























Copper Via Fill
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