HDI Copper Via Fill
Bare Board Specifications | |
Layer Count | 4 |
Copper Weight | 1 oz |
Min Line / Space | 4 / 4 mil |
Final Finish | ENIG + Soft, Wire-Bondable Gold |
Blind Vias | 1+2+1: L1-L2 + L3-L4 Cu-filled Blind Vias |
Buried Vias | Layer 2 - L3 Buried Vias |
Additional | Laser-Trimmed Black Coverlay; Copper Via Fill |