Lead Free Flex PCB Resource Center
Welcome to Saturn Flex Systems' Pb-Free Resource Center.
Topics range from laminate and final finish considerations to fabrication and assembly guidelines.
Should you require information on a topic that you don't find here, please contact us and we'll gladly research it for you.
Pre-Bake Suggestions for Pb-Free Final Finishes
||Higher Temp may reduce solderability|
|Silver||150°C||4 hrs||6 mths||Silver may tarnish, solderability not affected|
|ENIG||150°C||4 hrs||12 mths||No issues with extended bake on ENIG finish|
|OSP||105°C||4 hrs||3 mths||Extended bakes affect multiple heat cycles|
Commonly Called-Out Pb-Free Capable MaterialsLead-Free Assembly Compatible PWB Fabrication and Assembly Processing Guidelines
Technical Bulletin from Isola
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|Resin||4101/99, /124||4101/101, /121||4101/126, /129|
|Alt 1||Multifunctional Epoxy||Multifunctional Epoxy||Multifunctional Epoxy|
|Alt 2||MOD/non-Epoxy (max 5%)||MOD/non-Epoxy (max 5%)||MOD/non-Epoxy (max 5%)|
|Fillers||/99: Inorganic; /124: no||/101: Inorganic; /121: no||/126: Inorganic; /129: no|
|Tg||150 C min.||110 C min.||170 C min.|
|Td||325 C min.||310 C min.||340 C min.|
|T260 (min)||30 min||30 min||30 min|
|T288 (min)||5 min||5 min||15 min|
|T300 (min)||ABBUS||ABBUS||2 min|
|Latest on Lead-Free Capable Materials
Advancements in lead-free materials are not necessarily restricted to the materials themselves; they often develop in our knowledge base of the characteristics and performance criteria of the already available library of materials in the marketplace. According to Steve Jobs, “You can’t connect the dots looking forward; you can only connect them looking backwards.”
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