Specification for High Density Interconnect (HDI) and Microvia Materials

IPC-4104 covers the various conductive and dielectric materials that can be used for the fabrication of HDI and microvias. The specification sheets included in IPC-4104 cover the qualification and conformance requirements for such materials as photoimageable dielectric dry films and liquids, epoxy blends and coated foils.

Recommended Drawing Call-Outs

  • Specifying a slash sheet from this specification is the best way to designate the right material to be used
  • Refrain from specifying laminate or prepreg by brand name, Tg, or Td

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