Specification for Base Materials (Laminates)pcb-weight-calculator_CTA-sfs

IPC-4101 covers requirements for a wide range of base materials, referred to as laminate or prepreg, to be used during the fabrication of rigid multilayer printed circuit boards.

Recommended Drawing Call-Outs

Specifying a slash sheet from this specification is the best way to designate the right material you want to use in fabrication of your bare board.

Fabricator Note:
Refrain from specifying laminate or prepreg by:

  • Brand name
  • Tg
  • Td

Common Lead-Free Capable Materials

 RESIN 4101/99, /124 4101/101, /121 4101/126, /129
Primary Epoxy Difunctional epoxy Epoxy
Alt1 Multifunctional epoxy Multifunctional epoxy Multifunctional epoxy
Alt2 MOD/non-Epoxy (max 5%) MOD/non-epoxy (max 5%) MOD/non-epoxy (max 5%)
Fillers /99: inorganic; /124: no    /101: inorganic; /121: no /126: inorganic; /129: no
Tg 150 C min. 110 C min. 170 C min.
Td 325 C min. 310 C min. 340 C min.
T260 (min) 30 min 30 min 30 min
T288 (min) 5 min 5 min 15 min
T300 (min) ABBUS ABBUS 2 min

Heavy Cu fabrication methodologies
Part of the new Heavy Cu Resource Center
Specialized Etching and Plating methods for Heavy Copper PCB Design and Fabrication.
Etch-Down, Plate-Up