DFM Requirements

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 Arrow Copper Layers-Outer
 Arrow Copper Layers-Inner
 Arrow Fabrication Features
 Arrow Soldermask
 Arrow Coverlay
 Arrow Silkscreen
 Arrow Standard DFM Modifications
 Arrow Minimum Bend Radius





Copper Layers - Outer

 
1.5 oz Finished Copper
 DFM Rule  Min (Mils) Pref (Mils)
 Pad to Pad 5 6
 Pad to Circuit 5 6
 Circuit to Circuit 5 6
 Line Width 4 5
 Thermal Spoke Width        7 10
 Thermal Moat Width 10 12

















2 oz Finished Copper
 DFM Rule  Min (Mils) Pref (Mils)
 Pad to Pad 6 7
 Pad to Circuit 6 7
 Circuit to Circuit 6 7
 Line Width 5 6
 Thermal Spoke Width        8 10
 Thermal Moat Width 10 12

















3 oz Finished Copper
 DFM Rule  Min (Mils) Pref (Mils)
 Pad to Pad 8 9
 Pad to Circuit 8 9
 Circuit to Circuit 8 9
 Line Width 7 8
 Thermal Spoke Width        10 12
 Thermal Moat Width 10 12




 

 

 

 

 

  



Copper Layers - Inners

 
0.5 oz Finished Copper
 DFM Rule  Min (Mils) Pref (Mils)
 Pad to Pad 4 5
 Pad to Circuit 4 5
 Circuit to Circuit 4 5
 Line Width 4 5
 Thermal Spoke Width        7 10
 Thermal Moat Width 10 12

















1 oz Finished Copper
 DFM Rule  Min (Mils) Pref (Mils)
 Pad to Pad 6 7
 Pad to Circuit 6 7
 Circuit to Circuit 6 7
 Line Width 5 6
 Thermal Spoke Width        8 10
 Thermal Moat Width 10 12

















2 oz Finished Copper
 DFM Rule  Min (Mils) Pref (Mils)
 Pad to Pad 8 9
 Pad to Circuit 8 9
 Circuit to Circuit 8 9
 Line Width 7 8
 Thermal Spoke Width       
10 12
 Thermal Moat Width 10 12

 

 

 

 

 









Fabrication Features

 DFM Rule  Min (Mils) Pref (Mils)
 NPTH to Pad 10 10
 NPTH to Circuit 10 10
 Rout to Copper 5 7
 Scored edge to Copper 15 15
 PTH to Rigid Edge
15 20
 Trace to Flex Edge (edge insulation) 10 15
 Outside Dimensional Tolerance (Rigid) 5 7
 Outside Dimensional Tolerance (Flex) 10 15
 PTH to Copper (Inner Layers) 10 12
 PTH Annular Ring 5 7
 PTH Diameter Tolerance - Solder finish 3 3
 PTH Diameter Tolerance - Immersion finish 2 3
 Via Annular ring 5 7
 NPTH larger than 0.250" No No
 NPTH Drilled at Secondary Drill No No
 Blind Via Aspect Ratio 1:1 0.75:1




 

 

 

 

 

 

 

 

 

 

 














 


Flexible Soldermask

 DFM Rule  Min (Mils) Pref (Mils)
 NPTH Annular Ring 10 14
 Via Pad Annular Ring
0 0
 PTH Pad Annular Ring
2 3
 Coverlay to Feature Clearance
10 15
 SMD Annular Ring
2 3
 Mask Dam                                           
3 3




 

 

 

 

 



Coverlay

 DFM Rule  Min (Mils) Pref (Mils)
 NPTH Annular Ring 15 20
 Via Pad Annular Ring
0 0
 PTH Pad Annular Ring
5 10
 Coverlay to Feature Clearance
15 20
 SMD Annular Ring
n/a - gang opening n/a - gang opening
 Mask Dam                                           
n/a - gang opening n/a - gang opening

















Silkscreen

 DFM Rule  Min (Mils) Pref (Mils)
 Minimum Line Width                        5
5






Standard DFM Modications (FYI)

 DFM Rule
 Adjusted Value
 Silkscreen to Soldermask Opening
 2
 Soldermask Opening to Copper
 2






Minimum Bend Radius (FYI)

Multiple of Circuit Thicknes
 DFM Rule Min. Max.
 1 Metal Layer 3 6
 2 Metal Layers  6  10
 Multilayers  10  15
 Dynamic Flex (1L Recommended)  20  40