Flexible Circuit with Flip Chip Array
| Bare Board Specifications |
|
| Layer Count | 2 |
| Substrate | 2 mils |
| Copper Weight | 1 1/4 oz |
| Min Line / Space | 2 / 2 |
| Final Finish | ENEPIG |
| Glass Stiffener | Optical Glass; Polyimide for Connector |
| Additional | Flip Chip Array for Wire Bonding |
