High-Mobility Flexible Circuit
| Bare Board Specifications |
|
| Layers | 4 |
| Cu Weight | 1 oz |
| Min Ln/Sp | 5/5 mil |
| Finish | Electrolytic Gold |
| Industry | Medical |
| Assembly | Pressure sensitive adhesive (PSA) to ease Assembly |
| Additional | Stiffener supports flexible polyimide |
