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Printed Circuit Board Market Slated to Reach Nearly US$72.3 billion by 2026
EIN, November 2022
IndustryARC, in its latest report, predicts that Printed Circuit Board Market size is forecast to reach US$72.3 billion by 2026, at a CAGR of 5.3% during 2021-2026. Printed circuit boards (PCBs) are the foundational building block of most modern electronic devices. PCBs consist of printed pathways which connect different components on the PCB such as transistors, resistors, Programmable Logic Controller (PLCs), Electrolytic capacitors and integrated circuits. The PCB is used in several automotive applications such as power relays, antilock brake systems, digital displays, audio systems, engine timing systems, battery control systems and many more functions. Printed circuit boards are used in many ways in the automotive industry and have changed the way that people drive.
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Copper Is Here to Stay in Power Electronics
Rogers Corporation, August 2019
While silicon is the most common element used for power semiconductors, copper is the most popular choice for conductor traces on printed circuit boards (PCBs) and ceramic substrates due to its electrical conductivity. Copper is a well-established material for base plates and heat sinks because of its thermal conductivity. Furthermore, it has become important for the metallization and interconnection of power devices. The ever-growing power density, current carrying capability and reliability requirements are factors to why copper is already widespread in the industry. Copper is readily available, relatively inexpensive, and not likely to disappear anytime soon.
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SAP Utilizing Very Uniform Ultrathin Copper
iConnect007 August 2019
The demand for miniaturization and higher density electronic products has continued steadily for years, and this trend is expected to continue, according to various semiconductor technology and applications roadmaps. The printed circuit board (PCB) must support this trend as the central interconnection of the system. There are several options for fine line circuitry. A typical fine line circuit PCB product using copper foil technology, such as the modified semi-additive process (mSAP), uses a thin base copper layer made by pre-etching. The ultrathin copper foil process (SAP with ultrathin copper foil) is facing a technology limit for the miniaturization due to copper roughness and thickness control.
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