Glass Stiffener



Flex PCB with Flip Chip and Glass Stiffener
 Layers                               
2                                                   
 Substrate Thickness 2 mils
 Copper Weight              
1 1/4 oz
 Min Line / Space 2/2
 Final Finish ENEPIG
 Additional Details Flip Chip Array for Wire Bonding; Optical Glass Stiffener; Polyimide Stiffener for Connector


















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