Technology Roadmap

Customer-Driven Technological Capability

SFS FPC / Rigid-Flex manufacturability continues its rapid growth.

We also upgraded our rigid capabilities to now include cavities, HDI, sequential lamination, and heavy copper.

If there is a demand for a given process, Saturn Flex will make the necessary investments to add capability.



SFS Capabilities at a Glance
 Layer Count  1 - 24+
 Largest Panel Size  18" x 24"
 Smallest Circuit Width / Spacing                       .003 mils, .002 mils proto
 Material Types   Polyimide, PET, LPC, FR4, Teflon, Arlon, Metal Heatsink
 Smallest Mech. Drilled Hole  .004"
 Hole Size / Dimensional Tolerances                     +/- .003" and +/- .002"
 Final Finishes 
 HASL, Immersion Ag/Au/Sn, Deep Au, ENIG, ENEPIG, OSP
 Lead Free Finishes  Pb-Free HASL
 Electrical Testing  Flying Probe
 Fabrication  Routing & Scoring, Array Layouts
 Plasma Processing Unit
 Printed Electronics Ag Ink Bumping, Metal-Core, Heatsink
 Laser  Drilling, Routing and Trimming




































Materials

 Feature Current Capability Future Capabilities
 Substrate Min Thickness .001" .001"
 Max Operating Temperature  356F 500F
 Max Layer Count 24+ 30+
 Ag Conductive Ink Imped < 6 mΩ / Sq / Mil < 6 mΩ / Sq / Mil
















Fabrication

 Feature Current Capability Future Capabilities
 Min. Finished Hole Size          
.002" .001"
 Blind / Buried Vias .003" - .002" .001"
 Routing Tolerance .005" .005"
 Scoring Tolerance .005" .005"
















Imaging

 Feature Current Capability Future Capabilities
 Min Lines / Spaces                
.002" .001"
 Min Quad Flat Pack Pitch  .016" .016 - .012'
 Minimum Pad Size .004" .004" - .003"
 Soldermask Registration .003" .002"
 Soldermask Tolerance .002" .002"


















Plating and Surface Finishes


 Feature Current Capability Future Capabilities
 Finished Copper Thickness    
20 oz. 20 oz.
 Hot Air Solder Leveling Yes Yes
 Lead-Free Solder (HAL) Yes Yes
 Full Body Hard Ni / Au Yes Yes
 Immersion Gold / Silver Yes Yes
 Organic Surface Preservative Yes Yes