Rigid-Flex Bump Plating PCB
Bare Board Specifications | |
Layer Count | 6 |
Copper Weight | 1/2 oz |
Min Line / Space | 3 / 4 mil |
Final Finish | ENIG |
Buried Vias | Layer 2 - Layer 5 |
Industry | Medical |
Thickness | 0.001" Thickness Tolerance |
Additional |
Rigid-Flex Bump plating on Wing Pads |