Bump Plated PCB
| Bare Board Specifications | |
| Layer Count | 4 |
| Copper Weight | 0.25 oz base |
| Min Line / Space | 5 / 5 |
| Final Finish | ENIG |
| Advanced Technology | Bump Plated PCB |
| Additional Details | SMT Pads plated to 0.009" |
Heavily-Plated SMT Pads
