Via-in-Pad Alternatives
Traditional Via-In-Pad technology utilizes a complex sequence of processes to achieve the desired result of being able to solder to the top of a via or minimize component footprint.
We have taken experience from Asia to install an HDI via fill plating process that dramatically reduces the number of steps required while at the same time allowing for smaller circuit line and spacing.
Via-in-Pad - Plated Over | |
Processes 1. Inner Layer Image 2. DES 3. AOI 4. Oxide 5. Press 6. Drill Vias 7. Desmear 8. Plate 9. Button Image 10. Button Plate 11. Via Fill 12. Planarize 13. Shadow 14. Cap Plate 15. Drill Through Holes 16. Desmear 17. Plate 18. Image 19. Plate 20. SES 21. Normal Process... |
HDI - Plated Shut | |
Processes 1. Drill Inner Layer 2. Shadow 3. Image 4. Cu / Sn Plate 5. SES 6. ML Press 7. Drill Blinds 8. Via Fill Plate 9. Image 10. DES |