Economical Via-in-Pads


Process and materials information




Drill Vias in FR-4


drill-vias-fr4






Image / Plate / Etch Pads


etch-pads






Plug with PIHP


plug-pihp






Image / Develop PIHP


develop-pihp






Solder / Attach LED


solder-attach-led





Via-in-pad, plated over


Processes

1. Inner Layer Image

2. DES

3. AOI

4. Oxide

5. Press

6. Drill Vias

7. Desmear

8. Plate

9. Button Image

10. Button Plate

11. Via Fill

12. Planarize

13. Shadow

14. Cap Plate

15. Drill Through Holes

16. Desmear

17. Plate

18. Image

19. Plate

20. SES

21. Normal Process...


HDI - Plated Shut

Processes

1. Drill Inner Layer

2. Shadow

3. Image

4. Cu / Sn Plate

5. SES

6. ML Press

7. Drill Blinds

8. Via Fill Plate

9. Image

10. DES