Lead Free Resource Center
Welcome to Saturn Flex Systems' Pb-Free Resource Center.
Topics range from laminate and final finish considerations to fabrication and assembly guidelines.
Should you require information on a topic that you don't find here, please contact us and we'll gladly research it for you.
Pre-Bake Suggestions for Pb-Free Final Finishes
|Tin||125°C||4 hours||Higher Temp may reduce solderability|
|Silver||150°C||4 hours||Silver may tarnish, but solderability should not be affected|
|ENIG||150°C||4 hours||No issues with extended bake on ENIG finish|
|OSP||105°C||4 hours||Extended bakes may negatively impact multiple heat cycle assembly|
Commonly Called-Out Pb-Free Capable Materials
|4101/99, /124||4101/101, /121||4101/126, /129|
|Secondary 1||Multifunctional Epoxy||Multifunctional Epoxy||Multifunctional Epoxy|
|Secondary 2||Modified Epoxy or Non-epoxy (max 5%)||Modified Epoxy or Non-epoxy (max 5%)||Modified Epoxy or Non-epoxy (max 5%)|
|Tg||150 C min.||110 C min.||170 C min.|
|Td||325 C min.||310 C min.||340 C min.|
|T260 (min)||30 min||30 min||30 min|
|T288 (min)||5 min||5 min||15 min|
|T300 (min)||ABBUS||ABBUS||2 min|
|Latest on Lead-Free Capable Materials
PCB Magazine February 2012
Advancements in lead-free materials are not necessarily restricted to the materials themselves; they often develop in our knowledge base of the characteristics and performance criteria of the already available library of materials in the marketplace. This is truly the low-hanging fruit.
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