IPC-4552
ENIG Plating for Printed Circuit Boards
IPC-4552 details the requirements for Electroless Nickel Immersion Gold (ENIG) final finish.Recommended Drawing Call-Outs
Electroless Nickel/Immersion Gold (ENIG) per IPC-4552, or follow table below:
Note: IPC cautions that gold thickness above 4.925 µ" can indicate increased risk of having compromised the integrity of the nickel undercoat due to excessive corrosion. This is due to the influence of the design pattern and chemistry process variability. Therefore, Saturn's ENIG line is set-up to achieve IPC's recommended thicknesses.
Relevant Links
- Immersion Silver
- Immersion Tin Plating
- ENEPIG Plating
- Electrodeposited Coatings of Gold
- HASL
- Pb-free HASL
- OSP
- Deep Gold
- Soft, Wire Bondable Gold