Cover and Bonding Material for Flexible Printed Circuitry
IPC-4203 establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry, as well as supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry.
Recommended Drawing Call-Outs
- Specifying a slash sheet from this specification is the best way to designate the right material to be used
- Refrain from specifying laminate or prepreg by brand name