IPC-4101
Specification for Base Materials (Laminates)
IPC-4101 covers requirements for a wide range of base materials, referred to as laminate or prepreg, to be used during the fabrication of rigid multilayer printed circuit boards.Recommended Drawing Call-Outs
Specifying a slash sheet from this specification is the best way to designate the right material you want to use in fabrication of your bare board.Fabricator Note:
Refrain from specifying laminate or prepreg by:
- Brand name
- Tg
- Td
Common Lead-Free Capable Materials
| RESIN | 4101/99, /124 | 4101/101, /121 | 4101/126, /129 |
| Primary | Epoxy | Difunctional epoxy | Epoxy |
| Alt1 | Multifunctional epoxy | Multifunctional epoxy | Multifunctional epoxy |
| Alt2 | MOD/non-Epoxy (max 5%) | MOD/non-epoxy (max 5%) | MOD/non-epoxy (max 5%) |
| Fillers | /99: inorganic; /124: no | /101: inorganic; /121: no | /126: inorganic; /129: no |
| Tg | 150 C min. | 110 C min. | 170 C min. |
| Td | 325 C min. | 310 C min. | 340 C min. |
| T260 (min) | 30 min | 30 min | 30 min |
| T288 (min) | 5 min | 5 min | 15 min |
| T300 (min) | ABBUS | ABBUS | 2 min |
Heavy Cu fabrication methodologies
Part of the new Heavy Cu Resource Center
Specialized Etching and Plating methods for Heavy Copper PCB Design and Fabrication.
Etch-Down, Plate-Up