Common Issues for Castellation PCB
Plating over a large substrate surface can lead to the plated copper peeling due to a lack of adhesion strength. We address this by first roughening the surface through a combination of chemical and other proprietary means. We then use direct metallization, which has a higher copper bond strength, to prepare the surface for plating.
Often edge plating, especially on castellations, can result in burrs from the final machining process. We apply a modified, proprietary process flow that results in the burrs being polished down to the edge of the feature.