Technology Roadmap

Customer-Driven Technological Capability

SFS FPC / Rigid-Flex manufacturability continues its rapid growth.

We also upgraded our rigid capabilities to now include cavities, HDI, sequential lamination, and heavy copper.

If there is a demand for a given process, Saturn Flex will make the necessary investments to add capability.

SFS Capabilities at a Glance
Layer Count	1 - 48+
Largest Panel Size	30" x 30"
Smallest Circuit Width / Spacing	.003", .002" proto
Material Types	Polyimide, PET, LPC, FR4, Teflon, Arlon, Metal Heatsink
Min. Mech. Drilled Hole	.003"
Hole Size / Dimensional Tolerances	+/- .003" and +/- .002"
Final Finishes	HASL, Immersion Ag/Au/Sn, Deep Au, ENIG, ENEPIG, OSP
Lead Free Finishes	Pb-Free HASL
Electrical Testing	Flying Probe
Fabrication	Routing, Beveling, Scoring Array Layouts
Plasma Processing Unit	Printed Electronics Ag Ink Bumping, Metal-Core, Heatsink
Laser	Drilling, Routing and Trimming

Materials

Feature	Capability
Substrate Min Thickness	.001"
Max Operating Temperature	356F
Max. Finished Cu Thickness	20 oz
Ag Conductive Ink Imped	< 6 mΩ / Sq / Mil

Fabrication

Feature	Capability
Min. Finished Through Hole Size	.004"
Min. Blind Via Diameter	.002"
Routing Tolerance	.005"
Scoring Tolerance	.005"

Imaging

Feature	Capability
Min Lines / Spaces	.002"
Min Quad Flat Pack Pitch	.016"
Minimum Pad Size	.004"
Soldermask Registration	.003"