FPC PCB Capabilities Customer Driven Technological Capability SFS’s FPC / Rigid-Flex PCB manufacturing capabilities are among the Industry Leaders and continue to grow year-by-year at rapid rate.  If there is a demand for a given process, SFS will make the necessary investments to add capability. Capabilities at a Glance Layer Count 1 - 16+ Largest Panel Size 18" x 24" Smallest Circuit Width/Spacing .003 mils, .002 mils proto Material Types Polyimide, PET, LPC, FR4, Metal-Core Heat Sinks Smallest Mech. Drilled Hole .004" Hole Size & Dim. Tolerances +/- .003" and +/- .002" Finishes / Lead Free HASL, Immersion Silver/Gold, Deep Gold, Pb-Free HASL Electrical Testing Flying Probe Fabrication Routing & Scoring, Array Layouts Plasma Processing Unit Printed Electronics with Silver Ink Bumping, Metal-Core, Heat Sink Laser Drilling, Routing and Trimming                    PRODUCTION CAPABILITIES MATERIALS Feature Current Capability Future Capabilities Substrate Minimum Thickness 7.6μm < 7.6μm Max. Operating Temperature 356F 500F Maximum Layer Count 16 24 Silver Conductive Ink Impedance < 6 mΩ / Sq / Mil < 6 mΩ / Sq / Mil IMAGING CAPABILITIES Feature Current Capability Future Capabilities Minimum Finished Hole Size .004" .002" Blind/Buried Vias 6 mil 2-3 mil Routing Tolerance 5 mil 5 mil Scoring Tolerance 3 mil 3 mil IMAGING Feature Current Capability Future Capabilities Minimum Lines/Spaces .003" .002" - .001" Min. Quad Flat Pack Pitch .016" .016" - .012" Minimum Pad Size .005" .005" - .004" Soldermask Registration .003" .002" Soldermask Tolerance .002" .002" PLATING & SURFACE FINISHES Feature Current Capability Future Capability Finished Copper Thickness 20 ounce 20 ounce Hot Air Solder Leveling Yes Yes Lead-Free Solder (HAL) Yes Yes Full Body Hard Ni/AU Yes Yes Immersion Gold/Silver Yes Yes